Abstract
Recent large language models (LLMs) have demonstrated remarkable progress in 3D spatial reasoning, spatial grounding, and fine-grained geometric understanding. However, their ability to reason about densely packed object placement under strict spatial and functional constraints remains largely unexplored, despite being a fundamental challenge in practical electronic design automation (EDA) workflows. To bridge this gap, we introduce OmniLayout, the first benchmark designed to evaluate LLMs on printed-circuit-board (PCB) layout placement reasoning under real-world geometric, routing, and connectivity constraints. OmniLayout contains 1,681 industrial-grade schematic-coupled PCB layouts and includes four tasks: (1) geometric reasoning for IC physical placement, with 77.24K placement instances constrained within PCB board boundaries; (2) routability-aware placement reasoning, generating physically valid component placements; (3) electrical functionality, preserving schematic-specified connectivity and electronic functional correctness; and (4) tool-augmented agentic reasoning for invoking external tools to accomplish tasks (1)-(3). Our results reveal substantial limitations of current LLMs in PCB layout placement, including weak geometric reasoning, poor routability optimization, and inconsistent preservation of electrical functionality.