Abstract
Achieving high performance, energy efficiency, and cost-effectiveness whilemaintaining architectural flexibility is a critical challenge in thedevelopment and deployment of edge AI devices. Monolithic SoC designs strugglewith this complex balance mainly due to low manufacturing yields (below 16%) atadvanced 360 mm^2 process nodes. This paper presents a novel chiplet-basedRISC-V SoC architecture that addresses these limitations through modular AIacceleration and intelligent system level optimization. Our proposed designintegrates 4 different key innovations in a 30mm x 30mm silicon interposer:adaptive cross-chiplet Dynamic Voltage and Frequency Scaling (DVFS); AI-awareUniversal Chiplet Interconnect Express (UCIe) protocol extensions featuringstreaming flow control units and compression-aware transfers; distributedcryptographic security across heterogeneous chiplets; and intelligentsensor-driven load migration. The proposed architecture integrates a 7nm RISC-VCPU chiplet with dual 5nm AI accelerators (15 TOPS INT8 each), 16GB HBM3 memorystacks, and dedicated power management controllers. Experimental results acrossindustry standard benchmarks like MobileNetV2, ResNet-50 and real-time videoprocessing demonstrate significant performance improvements. The AI-optimizedconfiguration achieves ~14.7% latency reduction, 17.3% throughput improvement,and 16.2% power reduction compared to previous basic chiplet implementations.These improvements collectively translate to a 40.1% efficiency gaincorresponding to ~3.5 mJ per MobileNetV2 inference (860 mW/244 images/s), whilemaintaining sub-5ms real-time capability across all experimented workloads.These performance upgrades demonstrate that modular chiplet designs can achievenear-monolithic computational density while enabling cost efficiency,scalability and upgradeability, crucial for next-generation edge AI deviceapplications.