Abstract
This study focuses on the development of reinforcement learning basedtechniques for the design of microelectronic components under multiphysicsconstraints. While traditional design approaches based on global optimizationapproaches are effective when dealing with a small number of design parameters,as the complexity of the solution space and of the constraints increasesdifferent techniques are needed. This is an important reason that makes thedesign and optimization of microelectronic components (characterized by largesolution space and multiphysics constraints) very challenging for traditionalmethods. By taking as prototypical elements an application-specific integratedcircuit (ASIC) and a heterogeneously integrated (HI) interposer, we develop andnumerically test an optimization framework based on reinforcement learning(RL). More specifically, we consider the optimization of the bondedinterconnect geometry for an ASIC chip as well as the placement of componentson a HI interposer while satisfying thermoelastic and design constraints. Thisplacement problem is particularly interesting because it features ahigh-dimensional solution space.